Apple won’t release its next-generation iPhone until the fall of 2016, so there are still months of development ahead, but that hasn’t stopped some schematics reportedly depicting the upcoming handset from making an appearance.
In its June 2016 edition, Japanese monthly Mac Fan brings purported design schematics of Apple’s upcoming iPhone 7 Plus model, reiterating many of the design details that have been previously rumored for the device. The magazine states that the iPhone 7 Pro will feature the overall size dimensions of the iPhone 6s Plus, and that it will boast dual iSight cameras on the back, and won’t feature a 3.5mm headphone jack, either.
One interesting part revealed by the schematics is that the iPhone 7 Pro will reportedly measure in at 7.3mm thick, which is exactly the same size as the iPhone 6s Plus. That’s an interesting detail, considering many of the rumors surrounding Apple’s decision to remove the 3.5mm audio jack is to make it even thinner than the current generation devices. If these schematics are real, then that’s not what’s happening.
Also depicted in the schematic is the dual camera setup that’s rumored for the 5.5-inch iPhone 7 Plus, a Smart Connector, and the absence of a headphone jack. Apple is planning to remove the headphone jack in its 2016 devices, with headphones instead connecting via Lightning or Bluetooth. Though some rumors have suggested the iPhone 7 will include stereo speakers, the design drawing features a single speaker. No other significant details are included in the MacFan drawing.
The “Pro” designation is a bit different for the iPhone lineup, so it will be interesting to see if Apple goes with it later this year. Do you prefer “iPhone 7 Pro” or “iPhone 7 Plus?”